The Center focuses on the development characterization and analysis of the structural reliability of new materials for IC packaging and other applications. Some of the projects that have been launched include:
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Development of an impact machine for single solder ball impact strength of wafer level package |
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Materials characterization and failure analysis for microelectronics packaging and assembly |
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High performance plastic encapsulated IC packaging techniques |
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Development of new flux for lead-free flip-chip packages |
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PBA package design and assembly |
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Study of the relationship between microstructure-thermal and mechanical properties of PBGA substrate |
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Study of the relationships between IC package structure-materials selection-reliability using Finite Element Analysis |
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Reliability of flip chip package using lead free solder and "green" molding compound |
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Morphology and mechanical property relationships of weathered PVC pipes |
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High impact strength polymer nanocomposites with natural nanotubes |
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Toughened thermal plastic nanocomposites based on PP and nano-CaCO3 particles |